ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,753, issued on April 14, was assigned to Hyundai Mobis Co. Ltd. (Seoul, South Korea).
"Metal clip applied to power module" was invented by Se Min Park (Hwaseong-si, South Korea) and Ji Hye Jeong (Seoul, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A metal clip disposed on chips to connect the chips to each other, includes a plurality of bonding parts each having a lower surface configured to bond to an upper surface of each of the chips; and an outer side part formed at each of the bonding parts to extend upward from at least a portion of an outer side of respective ones of the bonding parts to form a step therefrom."
The patent was ...