US Patent Issued to HUNAN SIJIU TECHNOLOGY on Aug. 18 for "Heat transfer machine mold assembly for badge pattern" (Chinese Inventors)

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. D1,142,541, issued on Aug. 18, was assigned to HUNAN SIJIU TECHNOLOGY Co. LTD. (Changsha, China).

"Heat transfer machine mold assembly for badge pattern" was invented by Wenxiong Huang (Changsha, China) and Min Ai (Changsha, China).

The patent was filed on Aug. 8, 2025, under Application No. D/017,239.

*For further information, including images, charts and tables, please visit: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=1&f=G&l=50&co1=AND&d=PTXT&s1=D1142541&OS=D1142541&RS=D1142541

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