US Patent Issued to Huizhou Xunshuo Technology on May 26 for "Water block with air-cooling module and multi-layer heat-conducting structure" (Chinese Inventors)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,641,752, issued on May 26, was assigned to Huizhou Xunshuo Technology Co. Ltd (Huizhou City, China).

"Water block with air-cooling module and multi-layer heat-conducting structure" was invented by Yanzhun Lian (Huizhou, China) and Fuyin Wang (Huizhou, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A water block includes an air-cooling module, a multi-layer heat-conducting structure and a water pump. The air-cooling module is provided above the water pump, and a pump bottom casing is provided below the water pump. The multi-layer heat-conducting structure is provided below the pump bottom casing, and a heat-conducting bottom casing is provided below...