US Patent Issued to HUIKE (SINGAPORE) HOLDING on July 14 for "Ultrasonic fingerprint identification apparatus and lamination thickness adjustment method therefor, and electronic device" (Chinese Inventor)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,682,677, issued on July 14, was assigned to HUIKE (SINGAPORE) HOLDING PTE. LTD. (Singapore).

"Ultrasonic fingerprint identification apparatus and lamination thickness adjustment method therefor, and electronic device" was invented by Canhong Du (Shenzhen City, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments of the present disclosure provide an ultrasonic fingerprint identification apparatus and a lamination thickness adjustment method therefor, and an electronic device, and relate to the technical field of fingerprint identification. A specific embodiment of the ultrasonic fingerprint identification apparatus comprises: an integrated ch...