US Patent Issued to Hue on Aug. 25 for "Slicing micro-LED wafer and slicing micro-LED chip" (Chinese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,237, issued on Aug. 25, was assigned to Hue Inc. (Shanghai).

"Slicing micro-LED wafer and slicing micro-LED chip" was invented by Qunchao Xu (Shanghai) and Qiming Li (Shanghai).

According to the abstract* released by the U.S. Patent & Trademark Office: "A micro-light emitting diode (LED) chip includes a substrate and a plurality of micro-LEDs formed above the substrate. At least one of the plurality of micro-LEDs includes a bottom metal layer formed above the substrate, a light emitting layer formed above the bottom metal layer, an insulating layer above the light emitting layer and the bottom metal layer and including an opening exposing the light emitting layer, and a transpare...