US Patent Issued to Huawei Technologies on March 31 for "Semiconductor structure with diamond heat dissipation and manufacturing method thereof" (Japanese, Chinese Inventors)

ALEXANDRIA, Va., March 31 -- United States Patent no. 12,593,689, issued on March 31, was assigned to Huawei Technologies Co. LTD. (Shenzhen, China).

"Semiconductor structure with diamond heat dissipation and manufacturing method thereof" was invented by Ran He (Yokohama, Japan) and Huifang Jiao (Shenzhen, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments of this application provide a semiconductor structure, an electronic device, and a manufacture method for a semiconductor structure, and relate to the field of heat dissipation technologies for electronic products. An example semiconductor structure includes a semiconductor device, a bonding layer, a substrate, a conducting via, and a metal l...