US Patent Issued to Huawei Technologies on July 21 for "LED chip packaging module, fabrication method thereof, and display" (Chinese, Japanese Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,493, issued on July 21, was assigned to Huawei Technologies Co. Ltd. (Shenzhen, China).

"LED chip packaging module, fabrication method thereof, and display" was invented by Hsi Hsuan Yen (Chiba, Japan), Zhao Xiang (Dongguan, China), Haibiao Wei (Dongguan, China) and Jianhua Ding (Dongguan, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "An LED chip packaging module includes a re-distribution layer (RDL). A plurality of first pads are disposed on a lower surface of the RDL. A micro light emitting diode (LED) chip disposed on an upper surface of the RDL. An electrode of the micro LED chip faces the upper surface of the RDL and is connected to the...