US Patent Issued to Huawei Technologies'Co., 'Ltd.' on Oct. 27 for "Multi-side power delivery in stacked memory packaging" (Chinese, American Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,966, issued on Oct. 27, was assigned to Huawei Technologies'Co.'Ltd.' (Shenzhen, China).

"Multi-side power delivery in stacked memory packaging" was invented by Shiqun Gu (San Diego), Rui Niu (Beijing), Xiaodong Zhang (Shanghai), Yiwei Ren (Shanghai) and Tonglong Zhang (Shenzhen, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A packaged IC includes a fanout layer, a processor having a first surface residing substantially adjacent a first surface of the fanout layer, a Redistribution Layer (RDL) having a first surface coupled to a second surface of the processor, and a memory coupled to a second surface of the RDL, wherein a first portion of th...