US Patent Issued to Huawei Technologies'Co., 'Ltd.' on June 16 for "Chip stacking structure and manufacturing method thereof, chip package structure, and electronic device" (Chinese Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,710, issued on June 16, was assigned to Huawei Technologies'Co.'Ltd.' (Shenzhen, China).

"Chip stacking structure and manufacturing method thereof, chip package structure, and electronic device" was invented by Shan Gao (Shenzhen, China), Jifeng Zhu (Shanghai) and Dian Lei (Shenzhen, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A chip stacking structure includes a plurality of chips that are sequentially stacked and a first redistribution layer arranged on an active side of each chip. The plurality of chips include a first chip and a second chip that are located on an outermost side. Passive sides of the first chip and the second chip both f...