US Patent Issued to Huawei Technologies'Co., 'Ltd.' on Feb. 24 for "Board-level structure and communication device" (Chinese Inventor)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,563,672, issued on Feb. 24, was assigned to Huawei Technologies'Co.'Ltd.' (Shenzhen, China).

"Board-level structure and communication device" was invented by Ying Liang (Dongguan, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "The technology of this application relates to a board-level structure that includes an upper-layer substrate, a lower-layer substrate, and a plurality of support members that are supported between the upper-layer substrate and the lower-layer substrate. In an example embodiment, a gap exists between the upper-layer substrate and the lower-layer substrate, the gap includes at least one first gap region and at least one second...