US Patent Issued to Huawei Technologies'Co., 'Ltd.' on Aug. 25 for "Packaging module and electronic device" (Chinese, Japanese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,226, issued on Aug. 25, was assigned to Huawei Technologies'Co.'Ltd.' (Shenzhen, China).

"Packaging module and electronic device" was invented by Zhongli Ji (Shenzhen, China) and Wei Xu (Yokohama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A packaging module includes a substrate layer disposed in a stacking manner, and a plurality of chip layers stacked on the substrate layer. The plurality of chip layers include a top chip layer, and the top chip layer is a chip layer furthest from the substrate layer in the plurality of chip layers. The top chip layer includes a first chip, a connection surface of the first chip faces the substrate layer...