ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,758, issued on April 14, was assigned to Huawei Technologies'Co.'Ltd.' (Shenzhen, China).
"Chip packaging apparatus and preparation method thereof" was invented by Mao Guo (Shanghai), Yiwei Ren (Shanghai) and Xiaodong Zhang (Shanghai).
According to the abstract* released by the U.S. Patent & Trademark Office: "A chip packaging apparatus and a preparation method thereof are provided, to modulate warpage of a chip, thereby resolving a problem of mismatch between a warpage degree of the chip and a warpage degree of a substrate. The chip packaging apparatus includes a chip, a substrate, and a warpage modulation structure, where a surface that is of the chip and that faces the substr...