US Patent Issued to HTZ SOLUTIONS on April 14 for "Underground enclosure assembly and method" (Illinois, Minnesota Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,603,485, issued on April 14, was assigned to HTZ SOLUTIONS LLC (Northbrook, Ill.).

"Underground enclosure assembly and method" was invented by Jared Warrick (Huntley, Ill.), Justin W. Hillukka (Rockford, Minn.) and Daniel S. Jariabka (Northbrook, Ill.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An underground enclosure assembly configured for use with one or more of communications, power and/or irrigation system equipment. The underground enclosure assembly includes a shell assembly with at least two shell members coupled to each other via at least one snap projection and a lid removably coupled to the shell assembly via at least two bolt assemblies...