US Patent Issued to HRL Laboratories on May 5 for "Methods for 3D-integrating photonic chipsets by vertical assembly of lasers and passive components" (California Inventors)

ALEXANDRIA, Va., May 5 -- United States Patent no. 12,620,783, issued on May 5, was assigned to HRL Laboratories LLC (Malibu, Calif.).

"Methods for 3D-integrating photonic chipsets by vertical assembly of lasers and passive components" was invented by John Carlson (Westlake Village, Calif.), Travis Autry (Calabasas, Calif.) and Florian Herrault (Agoura Hills, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for making a vertically arranged array of edge-emitting lasers comprises: obtaining semiconductor chips that are laser diodes or semiconductor optical amplifiers; coating each of the semiconductor chips with a thermally conductive dielectric material; bonding the semiconductor chips onto a c...