US Patent Issued to HOYA on March 31 for "Substrate with multilayer reflective film, reflective mask blank, reflective mask, and method for manufacturing semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., March 31 -- United States Patent no. 12,591,173, issued on March 31, was assigned to HOYA Corp. (Tokyo).

"Substrate with multilayer reflective film, reflective mask blank, reflective mask, and method for manufacturing semiconductor device" was invented by Kota Suzuki (Tokyo), Masanori Nakagawa (Tokyo) and Takahiro Onoue (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided are a substrate with a multilayer reflective film, a reflective mask blank, a reflective mask, and a method for manufacturing a semiconductor device, having high resistance to an etching gas used for etching an absorber film and/or an etching mask film and capable of suppressing occurrence of blister.A substrate w...