US Patent Issued to HONOR DEVICE on Sept. 8 for "Method for manufacturing heat dissipation structure of electronic element, heat dissipation structure, and electronic device" (Chinese Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,129, issued on Sept. 8, was assigned to HONOR DEVICE Co. LTD. (Shenzhen, China).

"Method for manufacturing heat dissipation structure of electronic element, heat dissipation structure, and electronic device" was invented by Hanghang Dong (Shenzhen, China), Erliang Li (Shenzhen, China) and Junjie Yang (Shenzhen, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed are a method for manufacturing a heat dissipation structure of an electronic element, a heat dissipation structure, and an electronic device. The method includes: covering a periphery of an electronic element with a heat dissipation cover, where the heat dissipation cover is provi...