US Patent Issued to HONOR DEVICE on Oct. 27 for "Electronic device comprising recess in buffer component for removing heat generated by electronic components" (Chinese Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,621, issued on Oct. 27, was assigned to HONOR DEVICE Co. LTD. (Shenzhen, China).

"Electronic device comprising recess in buffer component for removing heat generated by electronic components" was invented by Guochao Fu (Shenzhen, China) and Yuanru Yang (Shenzhen, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic device includes a housing, a buffer component is connected to the housing, a first electronic element is located on a side that is of the buffer component and that is away from the housing, and a second electronic element is located on a side that is of the housing and that is away from the buffer component. The buffer compo...