US Patent Issued to Honor Device on March 17 for "Large-scale point cloud-oriented two-dimensional regularized planar projection and encoding and decoding method" (Chinese Inventors)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,581,132, issued on March 17, was assigned to Honor Device Co. Ltd. (Shenzhen, China).

"Large-scale point cloud-oriented two-dimensional regularized planar projection and encoding and decoding method" was invented by Fuzheng Yang (Shenzhen, China) and Wei Zhang (Shenzhen, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A large-scale point cloud-oriented two-dimensional regularized planar projection method and an encoding and decoding method are disclosed. The two-dimensional regularized planar projection method includes: obtaining original point cloud data; initializing a two-dimensional projection plane structure of a point cloud; and determining ...