US Patent Issued to HONOR DEVICE on July 28 for "Circuit board assembly, manufacturing method, and electronic device" (Chinese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,393, issued on July 28, was assigned to HONOR DEVICE Co. LTD. (Shenzhen, China).

"Circuit board assembly, manufacturing method, and electronic device" was invented by Fan Yang (Shenzhen, China), Jianqiang Guo (Shenzhen, China) and Mingchuan Li (Shenzhen, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A circuit board assembly, a manufacturing method are provided. The circuit board assembly includes a flexible printed circuit board and a printed circuit board, a pad for disposing a welding piece is provided on the printed circuit board, the flexible printed circuit board includes a main body and a welding part disposed on an inner wall of a thro...