ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,091, issued on Sept. 1, was assigned to HongQiSheng Precision Electronics (QinHuangDao) Co. Ltd. (Qinhuangdao, China), Avary Holding (Shenzhen) Co. Ltd. (Shenzhen, China) and GARUDA TECHNOLOGY CO LTD. (New Taipei, Taiwan).

"Circuit board assembly and method of manufacturing the same, packaging structure having the same" was invented by Chang-He Zhu (Qinhuangdao, China), Yang Li (Shenzhen, China), Jian Wang (Qinhuangdao, China), Li-Kun Liu (Shenzhen, China) and Yan-Lu Li (Shenzhen, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A circuit board assembly and a packaging structure are provided. A method of manufacturing the circuit board includes:...