US Patent Issued to Hong Kong HaiCun Technology on March 17 for "Discrete three-dimensional processor" (Oregon Inventor)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,582,006, issued on March 17, was assigned to Hong Kong HaiCun Technology Co. Ltd. (Kowloon, Hong Kong).

"Discrete three-dimensional processor" was invented by Guobiao Zhang (Corvallis, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A discrete three-dimensional (3-D) processor comprises communicatively coupled first and second dice. The first die comprises memory arrays, whereas the second die comprises at least a non-memory circuit and at least an off-die peripheral-circuit component of the memory arrays. The first and second dice have substantially different structures, more particularly back-end-of-line (BEOL) structures."

The patent was filed ...