US Patent Issued to Hong Kong Applied Science and Technology Research Institute on Sept. 1 for "Power converter package with copper-bar thermally-enhanced interposers to cooling fins" (Chinese, Chinese Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,129, issued on Sept. 1, was assigned to Hong Kong Applied Science and Technology Research Institute Co. Ltd. (Hong Kong, Hong Kong).

"Power converter package with copper-bar thermally-enhanced interposers to cooling fins" was invented by Danting Xu (Hong Kong, Hong Kong), Kun Wu (Shenzhen, China) and Ziyang Gao (Hong Kong, Hong Kong).

According to the abstract* released by the U.S. Patent & Trademark Office: "A power-converter module has a switching Printed Circuit Board (PCB) with power transistors generating heat. Ground, an input power supply, and an output power supply to the power transistors connect through metal traces on the switching PCB directly to interposer heat sinks...