US Patent Issued to Honeywell International on Aug. 4 for "Bonding layer between stacked integrated circuits" (Minnesota, Florida Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,773, issued on Aug. 4, was assigned to Honeywell International Inc. (Charlotte, N.C.).

"Bonding layer between stacked integrated circuits" was invented by James L. Tucker (Clearwater, Fla.), Eric E. Vogt (Independence, Minn.) and James W Karcz Jr. (Plymouth, Minn.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor assembly including: a first semiconductor having a plurality of electrical contacts extending from an upper surface of the first semiconductor; a second semiconductor adjacent to the first semiconductor; and a mesh disposed between and affixed to the upper surface of the first semiconductor and the lower surface of the second se...