US Patent Issued to Honeywell Federal Manufacturing & Technologies on July 14 for "Transparent package for use with printed circuit boards" (Missouri Inventor)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,689, issued on July 14, was assigned to Honeywell Federal Manufacturing & Technologies LLC (Kansas City, Mo.).

"Transparent package for use with printed circuit boards" was invented by Louis Diamond (Kansas City, Mo.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A blank package for mimicking an electronic component package comprises a body and a plurality of conductive pads. The body is formed from generally transparent electrically insulating material and has a top surface, a bottom surface, and a plurality of side surfaces. The bottom surface has a shape and dimensions that are similar to a bottom surface of the electronic component package. The ...