ALEXANDRIA, Va., March 3 -- United States Patent no. 12,567,557, issued on March 3, was assigned to Hitachi High-Tech Corp. (Tokyo).
"Ion milling device and ion milling method" was invented by Toru Iwaya (Minato-ku, Japan), Hisayuki Takasu (Minato-ku, Japan) and Sakae Koubori (Minato-ku, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a machining technology to obtain a desired machining content while suppressing a possibility of causing a redeposition in a machining surface. The invention is directed to provide an ion milling device which includes an ion source which emits an ion beam, a sample holder which holds a sample, and a sample sliding mechanism which slides the sample holder in a di...