US Patent Issued to Hitachi High-Tech on June 2 for "Contour line analysis apparatus, processing dimension extraction system, processing condition decision system, semiconductor device manufacturing system, and data structure" (Japanese Inventors)

ALEXANDRIA, Va., June 2 -- United States Patent no. 12,644,699, issued on June 2, was assigned to Hitachi High-Tech Corp. (Tokyo).

"Contour line analysis apparatus, processing dimension extraction system, processing condition decision system, semiconductor device manufacturing system, and data structure" was invented by Naoto Takano (Tokyo), Hyakka Nakada (Tokyo), Takeshi Ohmori (Tokyo) and Yutaka Okuyama (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "High-accuracy fitting for complex shapes that can occur in semiconductor processing is performed. A shape model is a curved line that is drawn with one stroke from its start point to its end point along a periphery of a figure that is a combination of on...