ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,012, issued on April 7, was assigned to Hitachi Energy Ltd (Zurich).
"Free configurable power semiconductor module" was invented by Juergen Schuderer (Zurich, Switzerland), Slavo Kicin (Zurich, Switzerland), Fabian Mohn (Ennetbaden, Switzerland) and Gernot Riedel (Baden-Rutihof, Switzerland).
According to the abstract* released by the U.S. Patent & Trademark Office: "A power semiconductor module includes a semiconductor board and a number of semiconductor chips attached to the semiconductor board. Each semiconductor chip has two power electrodes. An adapter board is attached to the semiconductor board above the semiconductor chips. The adapter board includes a terminal area for e...