US Patent Issued to Hitachi Astemo on July 28 for "Power semiconductor device with cooler herein" (Japanese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,764, issued on July 28, was assigned to Hitachi Astemo Ltd. (Ibaraki, Japan).

"Power semiconductor device with cooler herein" was invented by Junpei Kusukawa (Tokyo), Eiichi Ide (Tokyo), Takashi Hirao (Hitachinaka, Japan) and Yujiro Kaneko (Hitachinaka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A power semiconductor device includes a circuit body in which a conductor plate and a semiconductor element mounted on the conductor plate are sealed with a sealing resin, a cooler disposed opposite to at least one surface of the circuit body, and an insulating member disposed between the circuit body and the cooler. The insulating member includes ...