US Patent Issued to Hitachi Astemo on Aug. 4 for "Semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,683, issued on Aug. 4, was assigned to Hitachi Astemo Ltd. (Hitachinaka, Japan).

"Semiconductor device" was invented by Nobutake Tsuyuno (Tokyo), Yujiro Kaneko (Hitachinaka, Japan) and Yusuke Takagi (Hitachinaka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "In an electric circuit body, at least one of the cooling members fixed to both surfaces of a first semiconductor module and a second semiconductor module includes a first heat dissipation region that abuts on the first semiconductor module through a heat conduction member, a second heat dissipation region that abuts on the second semiconductor module through the heat conduction member, and...