US Patent Issued to HIRAYAMA MANUFACTURING on March 24 for "Highly accelerated stress test device and method for highly accelerated stress test" (Japanese Inventors)

ALEXANDRIA, Va., March 24 -- United States Patent no. 12,584,850, issued on March 24, was assigned to HIRAYAMA MANUFACTURING Corp. (Kasukabe, Japan).

"Highly accelerated stress test device and method for highly accelerated stress test" was invented by Akira Sato (Kasukabe, Japan), Shinichi Yumoto (Kasukabe, Japan) and Masahiro Uchita (Kasukabe, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A highly accelerated stress test device includes: a first heater that heats a test space; a second heater that heats a steam generating space; a first sensor that measures a first temperature of the test space; a second sensor that measures a second temperature of the steam generating space; an item temperature sens...