US Patent Issued to HIRATA on July 28 for "Wire bonding apparatus and control method" (Japanese Inventor)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,695,111, issued on July 28, was assigned to HIRATA Corp. (Kumamoto, Japan).

"Wire bonding apparatus and control method" was invented by Toru Miyazaki (Kumamoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wire bonding apparatus includes a conveying unit configured to convey a pallet on which a work is placed, at least one bonding head configured to perform wire bonding for the work, and a moving unit configured to move the at least one bonding head. The conveying unit includes a first conveying unit configured to convey the pallet to a work region, and a second conveying unit configured to convey the pallet in the work region. The second conv...