US Patent Issued to HICON on May 26 for "Socket device for testing ICs" (South Korean Inventors)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,638,473, issued on May 26, was assigned to HICON Co. LTD. (Seongnam-si, South Korea).

"Socket device for testing ICs" was invented by Dong Weon Hwang (Seongnam-si, South Korea), Jae Baek Hwang (Seongnam-si, South Korea), Jae Woo Park (Yongin-si, South Korea), Hyung Suk Park (Cheonan-si, South Korea) and Seung Woo Rhee (Seongnam-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Proposed is a socket device used for testing integrated circuits (ICs) and, more particularly, a test socket device with a thin structure especially suitable for ICs required to process high-speed signals. The socket device includes a socket body configured to accommod...