US Patent Issued to Hewlett Packard Enterprise Development on Oct. 6 for "Silicon-on-insulator photonic integrated circuits with integrated silicon photonic component and silicon/nitrogen photonic component" (California Inventor)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,754,369, issued on Oct. 6, was assigned to Hewlett Packard Enterprise Development LP (Spring, Texas).

"Silicon-on-insulator photonic integrated circuits with integrated silicon photonic component and silicon/nitrogen photonic component" was invented by Sagi Varghese Mathai (Sunnyvale, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A photonic integrated circuit may comprise a silicon substrate, a buried oxide (BOX) layer disposed on the silicon substrate, a silicon device layer disposed on the BOX layer, a first silicon waveguide in the silicon device layer, and a silicon/nitrogen waveguide optical amplifier disposed on the BOX layer. The first sil...