ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,743,050, issued on Sept. 22, was assigned to Hewlett-Packard Development Co. LP (Spring, Texas).
"Cooling device for fixing device" was invented by Satoshi Ohwada (Yokohama, Japan) and Hiroyuki Sato (Yokohama, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A cooling device includes a shaft that rotatably extends adjacent to a fixing device, a blade device including a blade coupled to the shaft, and a housing to accommodate the blade device, the housing including an inlet to draw in air and an outlet disposed to direct the air toward a heating body of the fixing device."
The patent was filed on April 12, 2023, under Application No. 18/866,067.
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