ALEXANDRIA, Va., April 15 -- United States Patent no. 12,600,135, issued on April 14, was assigned to Hewlett-Packard Development Co. LP (Spring, Texas).
"Polymer based conductive paths for fluidic dies" was invented by Bo Song (Corvallis, Ore.), Jacob Sterle (Corvallis, Ore.) and Tsuyoshi Yamashita (Corvallis, Ore.).
According to the abstract* released by the U.S. Patent & Trademark Office: "In example implementations, a fluidic die is provided. The fluidic die includes a silicon sliver with a plurality of nozzles to eject a printing fluid. A conductive path is deposited along a length of the silicon sliver on opposite sides of the silicon sliver. The conductive path and a portion of the silicon sliver are encapsulated by an epoxy moldin...