ALEXANDRIA, Va., July 7 -- United States Patent no. 12,673,382, issued on July 7, was assigned to Hesse GmbH (Paderborn, Germany).
"Ultrasonic bonding device and wire guiding module therefor" was invented by Frank Walther (Paderborn, Germany) and Sascha Bistry (Paderborn, Germany).
According to the abstract* released by the U.S. Patent & Trademark Office: "An ultrasonic bonding device includes a bonding head movable and/or positionable in a movement axis and rotatable and/or positionable about a rotational axis. The bonding head has a tool for ultrasonically bonding a bonding wire and a transducer module for exciting the tool to produce ultrasonic vibrations. The ultrasonic bonding device further includes: a stationary wire supply for the...