US Patent Issued to HERAEUS ELECTRONICS on Nov. 3 for "Production of surface-modified Cu ribbons for laser bonding" (German Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,784,938, issued on Nov. 3, was assigned to HERAEUS ELECTRONICS GMBH & Co. KG (Hanau, Germany).

"Production of surface-modified Cu ribbons for laser bonding" was invented by Marcel Neubauer (Hanau, Germany) and Frank Kruger (Hanau, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "The invention relates to a method for producing a wire, having at least the following steps: (i) providing a wire precursor; (ii) pressing depressions on the wire precursor and optionally reshaping the wire precursor in the process, and (iii) annealing the wire precursor provided with depressions in order to form the wire; wherein the wire has a content of at least 95 wt. %...