US Patent Issued to Henkel on March 31 for "Curable adhesive composition for die attach" (Chinese Inventors)

ALEXANDRIA, Va., March 31 -- United States Patent no. 12,590,228, issued on March 31, was assigned to Henkel AG & Co. KGaA (Duesseldorf, Germany).

"Curable adhesive composition for die attach" was invented by Yang Ti (Shanghai), Qili Wu (Shanghai), Wei Yao (Shanghai) and Jiawen Zhao (Shanghai).

According to the abstract* released by the U.S. Patent & Trademark Office: "This invention relates to a curable adhesive composition. In particular, the present invention relates to a curable adhesive composition for die attach, which eliminates the void issue, minimizes the fillet, and has lower bond line thickness and tilt trend, when cured."

The patent was filed on Nov. 16, 2020, under Application No. 17/098,750.

*For further information, incl...