ALEXANDRIA, Va., June 16 -- United States Patent no. 12,655,332, issued on June 16, was assigned to Henkel AG & Co. KGaA (Duesseldorf, Germany).
"Two-part epoxy-based structural adhesive composition" was invented by Bin Li (Shanghai), Yalong Qi (Shanghai), Chunfu Chen (Kanagawa Prefecture, Japan), Hongyu Chu (Shanghai) and Daoqiang Lu (Shanghai).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention relates to a two-part epoxy-based structural adhesive composition, comprising a first part and a second part, the first part comprising: i) a first aromatic difunctional epoxy resin having an epoxide equivalent weight (EEW) of less than 400 g/eq, ii) a second aromatic difunctional epoxy resin having ...