US Patent Issued to HENKEL on June 16 for "Hot melt adhesive and uses thereof" (New Jersey Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,655,329, issued on June 16, was assigned to HENKEL AG & Co. KGaA (Duesseldorf, Germany).

"Hot melt adhesive and uses thereof" was invented by Darshak Desai (Woodbridge, N.J.) and Yuhong Hu (Belle Mead, N.J.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Hot melt adhesive compositions prepared with a mixture of propylene copolymers are disclosed. The hot melt adhesive compositions require little to no oil content while providing high cohesion and excellent adhesion to nonwoven substrates and polymeric films. The hot melt adhesive compositions are particularly suitable for manufacturing absorbent construction articles."

The patent was filed on May 31, 20...