US Patent Issued to Henkel on Aug. 11 for "Flux-compatible epoxy-anhydride adhesives compositions for low-gap underfill applications" (Canadian, American Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,703,815, issued on Aug. 11, was assigned to Henkel AG & Co. KGaA (Duesseldorf, Germany).

"Flux-compatible epoxy-anhydride adhesives compositions for low-gap underfill applications" was invented by Sandeep Kapadia (Bellflower, Canada), Laxmisha M. Sridhar (Monmouth Junction, N.J.), Zhan Hang Yang (Rocky Hill, Conn.), Pukun Zhu (Irvine, Canada) and Sarah Liao (Claremont, Canada).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided are flux-compatible epoxy-anhydride compositions useful as low-gap underfill adhesives. The flux-compatible epoxy-anhydride compositions include an epoxy component and an anhydride composition comprising a monofunctional anhyd...