ALEXANDRIA, Va., April 15 -- United States Patent no. 12,600,888, issued on April 14, was assigned to Henkel AG & Co. KGaA (Duesseldorf, Germany).
"Dual-curable adhesive composition" was invented by Shingo Tsuno (Kanagawa, Japan) and Takayuki Kanno (Kanagawa, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "The object of the present invention is to provide an adhesive composition that has a low toxicity, is curable at a low temperature, and is capable of forming a cured product having high heat resistance. The present invention relates to a dual-curable adhesive composition comprising: (a1) an oxetane compound, (a2) an alicyclic epoxy compound, (a3) an aromatic glycidyl ether-based epoxy compound, (b) a ...