US Patent Issued to Hengdian Group DMEGC Magnetics on Sept. 1 for "Magnetic shielding structure for wireless charging and manufacturing method therefor" (Chinese Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,134, issued on Sept. 1, was assigned to Hengdian Group DMEGC Magnetics Co. Ltd (Dongyang City, China).

"Magnetic shielding structure for wireless charging and manufacturing method therefor" was invented by Lidong Liu (Dongyang City, China), Yaqi Fu (Dongyang City, China), Zishun Tang (Dongyang City, China), Feng Shi (Dongyang City, China) and Aiguo Zhang (Dongyang City, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed in the present text are a magnetic shielding structure for wireless charging and a manufacturing method therefor, which belong to the technical field of wireless charging. The magnetic shielding structure comprises: a plu...