ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,651, issued on June 16, was assigned to Hefei BOE Ruisheng Technology Co. Ltd. (Hefei, China) and BOE Technology Group Co. Ltd. (Beijing).
"Wiring substrate and electronic device" was invented by Xintao Wu (Beijing), Zouming Xu (Beijing), Jie Wang (Beijing), Jiawei Xu (Beijing), Ningyu Luo (Beijing), Tingwei Han (Beijing) and Yuan Li (Beijing).
According to the abstract* released by the U.S. Patent & Trademark Office: "Provided are a wiring substrate and an electronic device. The wiring substrate includes a substrate; a first pad group on the substrate, the first pad group including a power supply pad and an output pad; a power signal line on the same side of the substrate as the...