US Patent Issued to HD MICROSYSTEMS on April 14 for "Photosensitive resin composition, method for manufacturing patterned cured product, cured product, interlayer insulating film, cover coat layer, surface protective film, and electronic component" (Japanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,601,970, issued on April 14, was assigned to HD MICROSYSTEMS LTD. (Tokyo).

"Photosensitive resin composition, method for manufacturing patterned cured product, cured product, interlayer insulating film, cover coat layer, surface protective film, and electronic component" was invented by Hiroko Yotsuyanagi (Hitachi, Japan), Daisaku Matsukawa (Hitachi, Japan) and Noriyuki Yamazaki (Hitachi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A photosensitive resin composition comprising (A) a polyimide precursor having a polymerizable unsaturated bond; (B) a polymerizable monomer; (C) a photopolymerization initiator; and (D) an ultraviolet absorber."

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