US Patent Issued to HANGZHOU GUANGZHIYUAN TECHNOLOGY on March 31 for "Semiconductor devices and methods for manufacturing the same" (Chinese Inventors)

ALEXANDRIA, Va., March 31 -- United States Patent no. 12,593,724, issued on March 31, was assigned to HANGZHOU GUANGZHIYUAN TECHNOLOGY Co. LTD (Hangzhou City, China).

"Semiconductor devices and methods for manufacturing the same" was invented by Bo Peng (Hangzhou City, China), Huaiyu Meng (Hangzhou City, China) and Yichen Shen (Hangzhou City, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention relates to the field of photonic integrated circuits and provides a semiconductor device and a manufacturing method thereof. The semiconductor device includes an EIC chip and a PIC chip arranged on a substrate, the EIC chip is located between the PIC chip and the substrate. In embodiments, at lea...