US Patent Issued to HAMAMATSU PHOTONICS on Sept. 8 for "Thickness-distribution measurement device and thickness-distribution measurement method" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,729,951, issued on Sept. 8, was assigned to HAMAMATSU PHOTONICS K.K. (Hamamatsu, Japan).

"Thickness-distribution measurement device and thickness-distribution measurement method" was invented by Kunihiko Tsuchiya (Hamamatsu, Japan), Toru Matsumoto (Hamamatsu, Japan), Tetsuya Taka (Hamamatsu, Japan) and Kenichi Ohtsuka (Hamamatsu, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A thickness-distribution measurement device includes a light source; a light detector; and a control device. The light source irradiates a region of an object being conveyed with light, the region extending in a width direction. The light detector detects emitted light that h...