US Patent Issued to HAMAMATSU PHOTONICS on March 24 for "Semiconductor device comprising lead frame and bonding wire and manufacturing method for the semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., March 24 -- United States Patent no. 12,588,537, issued on March 24, was assigned to HAMAMATSU PHOTONICS K.K. (Hamamatsu, Japan).

"Semiconductor device comprising lead frame and bonding wire and manufacturing method for the semiconductor device" was invented by Ryousuke Kouda (Hamamatsu, Japan) and Kousuke Hirata (Hamamatsu, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a mounting substrate having a first surface, a semiconductor chip mounted on the first surface and having a second surface facing a side opposite to the first surface, and a wire extending from a first joint point on the first surface toward a second joint point on the second surface and...