US Patent Issued to HAMAMATSU PHOTONICS on March 17 for "Film thickness measuring device and film thickness measuring method" (Japanese Inventors)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,578,183, issued on March 17, was assigned to HAMAMATSU PHOTONICS K.K. (Hamamatsu, Japan).

"Film thickness measuring device and film thickness measuring method" was invented by Tomonori Nakamura (Hamamatsu, Japan), Kenichi Ohtsuka (Hamamatsu, Japan), Satoshi Arano (Hamamatsu, Japan) and Kunihiko Tsuchiya (Hamamatsu, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A film thickness measuring apparatus includes a light irradiation unit configured to irradiate an object with light in a planar shape, an optical element having a transmittance and a reflectance changing according to wavelengths in a predetermined wavelength range, the optical element bein...