US Patent Issued to HAMAMATSU PHOTONICS on June 30 for "Laser machining method and method for manufacturing semiconductor member" (Japanese Inventor)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,667,911, issued on June 30, was assigned to HAMAMATSU PHOTONICS K.K. (Hamamatsu, Japan).

"Laser machining method and method for manufacturing semiconductor member" was invented by Takeshi Sakamoto (Hamamatsu, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A laser processing method includes a laser processing step of converging laser light to an object including a first surface and a second surface opposite to the first surface using the first surface as an incident surface to form a converging spot of the laser light, while relatively moving the converging spot with respect to the object, thereby performing laser processing in the object, the obje...